為了改善環氧樹脂易脆的性質與增加在低溫環境的使用率﹐添加聚矽氧烷可做為環氧樹脂的改質劑﹐增加其韌性。由於環氧樹脂與聚矽氧烷兩者溶解參數值相差太大﹐造成兩者間不互溶。因此我們添加偶合劑(Coupling agent)將環氧樹脂與聚矽氧烷以化學鍵方式鍵結在一起，增加系統的相容性。 為了增進偶合劑與環氧樹脂的相容性，本實驗先將環氧樹脂與矽烷偶合劑進行預反應。再分別添加不同偶合劑與不同比例聚矽氧烷於各個環氧樹脂系統內﹐利用光學儀器觀察並分析不同偶合劑對聚矽氧烷相行為所產生的影響。另外以耐衝擊來進行機械性質測試﹐觀察何種偶合劑及聚矽氧烷添加量對系統有最佳增韌效果。由實驗結果得知﹐利用Epikote 828所合成出的偶合劑可使聚矽氧烷相形成最小平均粒徑。聚矽氧烷添加量只需添加5phr即可提升系統之機械性質。此外，由於電子封裝材中常會添加大量填充料(fillers)，降低成本及改善材料性質，因此於本實驗系統中添加不同比例石英砂，對系統聚矽氧烷相行為及系統機械性質一併加以探討。 In order to improve the crumbly behavior of epoxy resins for low temperature application, one intends append polysiloxane to be stress-relief additives to improve its toughness. However, they are not compatible due to the fact that the discrepant on their solubility parameters is high. One way to resolve the this problem is by adding coupling agent to bond epoxy resin and polysiloxane together which in turn raises the capacity of system. To increase the capacity of coupling agent, with a small amount of we first reacted the coupling agent with a small amount of epoxy resin. The reacted coupling agents were then blended into different epoxy systems. Both morphology and impact properties of the polysiloxane-added resin were studied. From the results of the experiment, coupling agent, which reacted with Epikote 828, generated the smallest size of the polysiloxane particles. Only 5 phr significantly of polysiloxane is enough to raise the mechanical properties of the system. We have also discusses the changes in the polysiloxane phase and mechanical properties of the system when silica filler was added.
