Thermal improvement of die attach with iodine treatment and its application in solid state lighting

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Please use this identifier to cite or link to this item: http://140.128.103.80:8080/handle/310901/21199

Title:	Thermal improvement of die attach with iodine treatment and its application in solid state lighting
Authors:	Zhang, K.,?Zhang, X.,?Zhang, M.,?Yang, C.,?Sun, H.,?Yuen, M.,?Zhong, B.,?Bok, A.R.,?Liu, L.,?Chan, C.Y.,?Zhang, G.
Contributors:	Department of Chemistry, Tunghai University
Keywords:	Die-attach materials;Iodine treatment;Polymer networks;Solid state lighting;Thermal conductivity enhancement;Thermal Performance
Date:	20120416--
Issue Date:	2013-05-14T09:03:18Z (UTC)
Publisher:	Cascais; Portugal
Abstract:	The mechanism of thermal conductivity enhancement of silver epoxy based die attach materials (DA) by iodine treatment is studied. Iodine treatment is found to be able to uniform the polymer network and accelerate the curing of die attach at relatively lower temperature with shorter curing duration. In addition, several metal halide salts are proved to have the same effect as the iodine treatment and be able to improve the conductivity of DA. The developed DA is applied in LED packages. The thermal performance of LED packages is evaluated to demonstrate the effect of iodine treatment of DA. ? 2012 IEEE.
Relation:	2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 , art. no. 6191733
Appears in Collections:	[化學系所] 會議論文

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