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    Please use this identifier to cite or link to this item: http://140.128.103.80:8080/handle/310901/21696


    Title: On-state resistance improvement by partially slotted stildmos transistor in 0.25-micron smart power technology
    Authors: Su, R.Y., Chiang, P.Y., Gong, J., Huang, T.Y., Tsai, J.L., Liu, M., Chou, C.C.
    Contributors: Department of Electrical Engineering, Tunghai University
    Keywords: Bi-CMOS;Break down voltages;Medium voltages;On-state resistances;Power devices;Shallow trench isolations;Smart power technologies;STI structures
    Date: 2008-10-20
    Issue Date: 2013-05-15T09:04:33Z (UTC)
    Publisher: Beijing; China
    Abstract: The improvement of on-state resistance with partially slotted STI (Shallow Trench Isolation) for medium voltage power devices in an advanced 0.25um BiCMOS-DMOS process is implemented. Experiment results show that our proposed device can reduce 20% R on without hurting breakdown voltage. The partially slotted STI structure avoids breakdown voltage to decrease and also shortens the drain current path due to a 3-dimentional electric field shaping. Careful design for slotted STI profile is needed to achieve the optimum R on-BV tradeoff performance. ? 2008 IEEE.
    Relation: International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT , art. no. 4734498 , pp. 199-202
    Appears in Collections:[電機工程學系所] 會議論文

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