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    Please use this identifier to cite or link to this item: http://140.128.103.80:8080/handle/310901/4275


    Title: IC廠於晶圓區間平穩差值流控技術下之作業系統評估
    Other Titles: Estimation of Wafer Fabrication under the WISSV Flow Control Technique
    Authors: 李綜益
    Contributors: 劉力
    Liu, L
    東海大學數學系
    Keywords: 積體電路;晶圓區間平穩差值;流控技術;在製品量;先到先服務
    wafer;throughput;flow-control
    Date: 2002
    Issue Date: 2011-05-19T05:53:50Z (UTC)
    Abstract: 本論文繼續先前一系列的,有關於積體電路廠之晶圓區間平穩差值流控技術下的作業系統的研究。希望此技術能為人們瞭解和列入討論。我們提出作業系統產能評估的方法與估算的式子: 在單製程作業系統其產值的準確度方面,較經驗方式的作法好很多;而在雙製程作業系統之不同成品需求比的產值的估算上,也有不錯的結果。至於評估上甚為困難的機器台數的配置和訂單何時交貨的問題亦提出有效,執行步驟簡單,並有學理根據的作法。我們亦考慮成品比和在製品量以及先到先服務之派工順位的機制,修改了相關之晶圓釋放與機器派工的法則,使得原先之成品流出的比率和晶圓系統時間變異數的值獲得明顯的改善。樂見此技術進一步的研究和發展。
    This paper continues a series of studies which is about the operating system under the so-called wafer-interval-smoothness-short-value, flow-control technique in wafer fabrication. We propose methods of the estimation for the throughput of the operating systems: the result shows they are not only better than the experience method in accuracy in the single-process operating system, but also good in the double-process operating system. As for the rather difficult problems like the distribution of the number of the machines and the time of order delivery, we present an efficient method with simple operating steps. Furthermore, we put the demands on various finished product, the amount of wafer in process, and the first-come, first-served queue discipline into consideration in making slight modification on the rules of wafer releasing and dispatching, the improvement of the rate of finished product and the variance of system time of the wafer is obvious. We wish to see this series of studies could be further developed.
    Appears in Collections:[應用數學系所] 碩博士論文

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