本論文繼續先前一系列的，有關於積體電路廠之在製品分散流控技術的研究，希望此技術能為人們瞭解和列入討論。除了重寫和整理原先的投料及派工的作法，亦就等候理論角度解析如此派工的構想在整體流控方面的優點。其次，加入能提高瓶頸機器使用率之另一些設計；以實驗性質製程二為例，其相關單製程作業系統的年產值較原技術下的增值7.9%。再者，吾人進一步的舉證和說明傳統流控技術架構為先有生產計劃與排程，然後構思層級在下的投料及派工的作法；而我們的技術正好逆向思維，先有投料及派工的設計，再以此為基礎，主導相關之生產的規劃，且其發展潛力良好。上述的成果係與同窗盧俊杰一起研究；各自論文的撰寫方面，主要的結果一致，惟細節上，盧君偏重投料及派工逆向主導生產規劃其文獻比較和實例方面的說明，而本人則偏重此一在製品分散流控技術的呈現與修正。 This research is the continuation of studies about the flow-control technique of WIP scatteration in wafer fabrication. We hope these techniques will be understood and discussed in the future. First, except for rewriting the previous methodologies on wafer release and dispatching, this research also emphasizes on the advantage of such structure of dispatching on macro procedure management from the queuing theory point of view. In addition, the research adds several designs that can increase the bottleneck machines utilization rate. Use the second experimental procedure as an example, its yearly throughput of the related single-process operation system has increases 7.9% over the original technique. At last, other than the traditional procedure control technique in terms of its production planning and scheduling, and then instruct lower level wafer releasing and dispatching methods, our methodology goes in the opposite way: having the releasing and dispatching designs first, and then use it as a base to direct related production planning. Such a methodology yielded many developmental potential. The study above is done by Mr. Lu and I. We share the same results of the study but branch out in writing up the theses. Mr. Lu puts stress on the literature comparison and practical explanation for the reverse releasing and dispatching productive scheme. I emphasize on the explanation and correction for the flow-control technique of WIP scatteration.
