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    Please use this identifier to cite or link to this item: http://140.128.103.80:8080/handle/310901/21726


    Title: A highly stackable Thin-Film Transistor (TFT) NAND-type flash memory
    Authors: Lai, E.-K.,?Lue, H.-T.,?Hsiao, Y.-H.,?Hsieh, J.-Y.,?Lee, S.-C.,?Lu, C.-P.,?Wang, S.-Y.,?Yang, L.-W.,?Chen, K.-C.,?Gong, J.,?Hsieh, K.-Y.,?Ku, J.,?Liu, R.,?Lu, C.-Y.
    Contributors: Department of Electrical Engineering, Tunghai University
    Keywords: Energy gap;Flash memory;NAND circuits;Polysilicon
    Date: 2006
    Issue Date: 2013-05-15T09:04:56Z (UTC)
    Abstract: For the first time, a successful TFT NAND-type Flash memory is demonstrated using a low thermal budget process suitable for stacking the memories. A TFT-SONOS device using bandgap engineered SONOS (BE-SONOS) [1] with fully-depleted (FD) poly silicon (50 nm) channel and tri-gate P +-poly gate is integrated into a NAND array. Small devices (LAV=O. 18/0.09 um) with good DC performance are achieved, owing to the good control capability of the tri-gate FD structure. Successful NAND array functions are demonstrated, with more than 1 μA read current for a 16-string NAND array and good program disturb immunity. This new device also shows good endurance and data retention, and negligible read disturb. These results are very encouraging for future 3D Flash memory. ? 2006 IEEE.
    Relation: Digest of Technical Papers - Symposium on VLSI Technology , art. no. 1705209 , pp. 46-47
    Appears in Collections:[電機工程學系所] 會議論文

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